Method for Filing at least One Hole formed in a Printed Circuit Board, a Printed Circuit Board filled in such a Manner, and a Vehicle Comprising such a Printed Circuit Board
OwnerHubertus Heininventor
Life of this patent
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Abstract
Disclosed are a method for filling at least one hole formed in a printed circuit board, a printed circuit board filled in such a manner, and a vehicle having such a printed circuit board. The method of filling at least one hole formed in a printed circuit board comprises: introducing a paste comprising an electrically conductive metal powder and an electrolyte into the at least one hole of the printed circuit board, S1; and galvanic metallization of the printed circuit board so that elemental metal is deposited from the electrolyte in the at least one hole during the galvanic metallisation, S2.
Claims18
A method for filling at least one hole formed in a printed circuit board, the method comprising:
- introducing a paste comprising an electrically conductive metal powder and an electrolyte into the at least one hole of the printed circuit board;
- and
- galvanic metallisation of the printed circuit board so that elemental metal is deposited from the electrolyte in the at least one hole during the galvanic metallisation.
Dependencies are inferred from the claim text.