C23F 1/34
For etching copper or alloys thereof
Official title: for etching copper or alloys thereof
C23F1/34 (For etching copper or alloys thereof) appears on 78 US grants and 89 published applications in this corpus.
Search patents in C23F- Granted patents
- 78
- Published applications
- 89
- Assignees
- 59
- Inventors
- 181
- Latest grant
- 23 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 4 | 1 |
| 2003 | 2 | 0 |
| 2004 | 1 | 3 |
| 2005 | 0 | 6 |
| 2006 | 4 | 6 |
| 2007 | 1 | 4 |
| 2008 | 3 | 7 |
| 2009 | 5 | 1 |
| 2010 | 3 | 4 |
| 2011 | 4 | 4 |
| 2012 | 2 | 1 |
| 2013 | 6 | 3 |
| 2014 | 1 | 6 |
| 2015 | 6 | 5 |
| 2016 | 3 | 10 |
| 2017 | 2 | 2 |
| 2018 | 4 | 1 |
| 2019 | 3 | 3 |
| 2020 | 0 | 1 |
| 2021 | 3 | 2 |
| 2022 | 2 | 5 |
| 2023 | 2 | 7 |
| 2024 | 6 | 1 |
| 2025 | 1 | 2 |
| 2026 | 0 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper etching solution23 Dec 2025US 12,503,775 B2C. Uyemura & Co., Ltd.
- Eco-friendly hydrophobic or ultrahydrophobic coating method19 Nov 2024US 12,146,070 B2Postech Research and Business Development Foundation
- Co/Cu selective wet etchant8 Oct 2024US 12,110,436 B2Versum Materials US, LLC
- Negative electrode comprising a protective layer for a lithium secondary battery, method for manufacturing same, and lithium secondary battery including same1 Oct 2024US 12,107,259 B2Iucf-Hyu (Industry-University Cooperation Foundation Hanyang University)
- Nanotextured metal powders for 3D printing of metals26 Mar 2024US 11,938,536 B2The Board of Trustees of the Leland Stanford Junior University
- Composition, method of treating metal-containing layer, and method of manufacturing semiconductor device4 Jun 2026US 2026/0152687 A1Samsung Electronics Co., Ltd.
- Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same9 Apr 2026US 2026/0098346 A1Samsung Electronics Co., Ltd.
- Porous metal structure and method for preparing same15 Jan 2026US 2026/0015703 A1Contemporary Amperex Technology Co., Limited
- Composition, method of treating metal-containing layer by using the same, and method of manufacturing semiconductor device by using the same1 Jan 2026US 2026/0005029 A1Samsung Electronics Co., Ltd.
- Process for etching circuit board with alkaline tetraamminecopper (ii) sulfate and apparatus therefor18 Sep 2025US 2025/0290205 A1
Most cited
By later US patents
- Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride addition30US 9,012,322 B2Intermolecular, Inc. · 2015
- Composition and method for etching copper substrates28US 4,311,551 APhilip A. Hunt Chemical Corporation · 1982
- Etchant for copper or copper alloys27US 6,426,020 B1Mec Company Ltd. · 2002
- Aqueous cleaner with low metal etch rate comprising alkanolamine and tetraalkylammonium hydroxide27US 7,365,045 B2Advanced Tehnology Materials, Inc. · 2008
- Compositions and processes for photoresist stripping and residue removal in wafer level packaging20US 7,579,308 B2EKC/DuPont Electronics Technologies · 2009