Compositions and processes for photoresist stripping and residue removal in wafer level packaging
AssigneeEKC/DuPont Electronics Technologies
InventorWai Mun Lee
Life of this patent
Estimating the term…
Abstract
Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrates with mixtures containing an effective amount of organic ammonium compound(s); from about 2 to about 20 weight percent of oxammonium compound(s); optionally organic solvent(s); and water.
Claims9
A composition for removing a polymer, etch residue, ash residue, or a combination thereof from a substrate on which a circuit or a portion of a circuit is present, which composition comprises:
- an organic ammonium compound having the formula
- wherein:
- X is hydroxide, sulfate, hydrogen sulfate, phosphate, hydrogen phosphate, dihydrogen phosphate, nitrate, a carboxylate, a halide, carbonate, hydrogen carbonate, bifluoride, or a combination thereof,
- R1 is an alkyl group or a group derived from the reaction of a tertiary amine with an organic epoxy, and
- R2, R3, and R4 are each not hydrogen and are independently alkyl, benzyl, hydroxyalkyl, phenyl, a group derived from the reaction of a tertiary amine with an organic epoxy, or another group contained in a tertiary amine;
- more than about 2% by weight of an oxoammonium compound having the formula
- wherein:
- X is hydroxide, sulfate, hydrogen sulfate, phosphate, hydrogen phosphate, dihydrogen phosphate, nitrate, a carboxylate, a halide, carbonate, hydrogen carbonate, bifluoride, or a combination thereof,
- each R5 is independently hydrogen, a substituted C1-C6 straight, branched, or cyclic alkyl, alkenyl, or alkynyl group, a substituted acyl group, straight or branched alkoxy group, amidyl group, carboxyl group, alkoxyalkyl group, alkylamino group, alkylsulfonyl group, or sulfonic acid group, phenyl group, substituted phenyl group, aryl group, substituted aryl group, or a salt or derivative thereof, and
- each R6 and R7 is independently hydrogen, a hydroxyl group, a substituted C1-C6 straight, branched, or cyclic alkyl, alkenyl, or alkynyl group, a substituted acyl group, straight or branched alkoxy group, amidyl group, carboxyl group, alkoxyalkyl group, alkylamino group, alkylsulfonyl group, or sulfonic acid group, phenyl group, substituted phenyl group, aryl group, substituted aryl group, or a salt or derivative thereof;
- an organic polar solvent that is miscible with water and water,
- wherein the composition is capable of removing the polymer, the etch residue, the ash residue, or the combination thereof from the substrate, while maintaining the operability of the circuit, or portion thereof, associated with the substrate,
- wherein the pH of the composition is above about 9, and
- wherein the organic ammonium compound is present in an amount from about 1% to about 30% by weight, the water is present in an amount from about 15% to about 94% by weight, the organic polar solvent is present in an amount from about 25% to about 85% by weight, and the oxoammonium compound is present in an amount not more than about 10% by weight.
A composition for removing a polymer proximate to which a circuit, or a portion of a circuit, is disposed, which composition comprises:
- an organic ammonium compound having the formula
- wherein:
- X is hydroxide, sulfate, hydrogen sulfate, phosphate, hydrogen phosphate, dihydrogen phosphate, nitrate, a carboxylate, a halide, carbonate, hydrogen carbonate, bifluoride, or a combination thereof,
- R, is an alkyl group or a group derived from the reaction of a tertiary amine with an organic epoxy, and
- R2, R3, and R4 are each not hydrogen and are independently alkyl, benzyl, hydroxyalkyl, phenyl, a group derived from the reaction of a tertiary amine with an organic epoxy, or another group contained in a tertiary amine;
- more than about 2% by weight of an oxoammonium compound having the formula
- wherein:
- X is hydroxide, sulfate, hydrogen sulfate, phosphate, hydrogen phosphate, dihydrogen phosphate, nitrate, a carboxylate, a halide, carbonate, hydrogen carbonate, bifluoride, or a combination thereof,
- each R5 is independently hydrogen, a substituted C1-C5 straight, branched, or cyclic alkyl, alkenyl, or alkynyl group, a substituted acyl group, straight or branched alkoxy group, amidyl group, carboxyl group, alkoxyalkyl group, alkylamino group, alkylsulfonyl group, or sulfonic acid group, phenyl group, substituted phenyl group, aryl group, substituted aryl group, or a salt or derivative thereof, and
- each R6 and R7 is independently hydrogen, a hydroxyl group,
- a substituted C1-C6 straight, branched, or cyclic alkyl, alkenyl, or alkynyl group, a substituted acyl group, straight or branched alkoxy group, amidyl group, carboxyl group, alkoxyalkyl group, alkylamino group, alkylsulfonyl group, or sulfonic acid group, phenyl group, substituted phenyl group, aryl group, substituted aryl group, or a salt or derivative thereof;
- an organic polar solvent that is miscible with water and water,
- wherein the polymer comprises a carbonyl moiety, a carboxyl moiety, a nitrile moiety, an imide moiety, or a combination thereof;
- and
- wherein the composition is capable of removing the polymer by interaction with the carbonyl moiety, the carboxyl moiety, the nitrile moiety, the imide moiety, or the combination thereof, while maintaining the operability of the circuit, or portion thereof, proximate thereto,
- wherein the pH of the composition is above about 9, and
- wherein the organic ammonium compound is present in an amount from about 1% to about 30% by weight, the water is present in an amount from about 15% to about 94% by weight, the organic polar solvent is present in an amount from about 25% to about 85% by weight, and the oxoammonium compound is present in an amount not more than about 10% by weight.
Dependencies are inferred from the claim text.