C23C 18/30
Activating or accelerating or sensitising with palladium or other noble metal
Official title: Activating {or accelerating or sensitising with palladium or other noble metal}
C23C18/30 (Activating or accelerating or sensitising with palladium or other noble metal) appears on 618 US grants and 668 published applications in this corpus.
Search patents in C23C- Granted patents
- 618
- Published applications
- 668
- Assignees
- 395
- Inventors
- 1,725
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 6 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 5 | 0 |
| 1986 | 9 | 0 |
| 1987 | 16 | 0 |
| 1988 | 10 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 17 | 0 |
| 1992 | 12 | 0 |
| 1993 | 14 | 0 |
| 1994 | 12 | 0 |
| 1995 | 21 | 0 |
| 1996 | 12 | 0 |
| 1997 | 12 | 0 |
| 1998 | 9 | 0 |
| 1999 | 18 | 0 |
| 2000 | 6 | 0 |
| 2001 | 7 | 5 |
| 2002 | 15 | 15 |
| 2003 | 8 | 13 |
| 2004 | 8 | 16 |
| 2005 | 5 | 35 |
| 2006 | 10 | 18 |
| 2007 | 9 | 26 |
| 2008 | 7 | 22 |
| 2009 | 11 | 34 |
| 2010 | 10 | 35 |
| 2011 | 15 | 20 |
| 2012 | 23 | 23 |
| 2013 | 11 | 19 |
| 2014 | 15 | 27 |
| 2015 | 16 | 49 |
| 2016 | 26 | 54 |
| 2017 | 30 | 43 |
| 2018 | 26 | 39 |
| 2019 | 30 | 45 |
| 2020 | 22 | 41 |
| 2021 | 27 | 17 |
| 2022 | 16 | 14 |
| 2023 | 9 | 15 |
| 2024 | 11 | 18 |
| 2025 | 8 | 16 |
| 2026 | 7 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metallized polymer particles and related methods2 Jun 2026US 12,644,187 B2Xerox Corporation
- Conductive nonwoven fabric, and method for manufacturing conductive nonwoven fabric21 Apr 2026US 12,609,214 B2Yazaki Corporation
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Thermoplastic resin composition, method of preparing thermoplastic resin composition, molded article including thermoplastic resin composition, and method of manufacturing molded article20 Aug 2026US 2026/0242585 A1LG Chem.Ltd.
- Chromium acid etching free metal plating of blends of acrylonitrile-butadiene-styrene and polar polymer16 Jul 2026US 2026/0201157 A1Sabic Global Technologies B.V.
- Method of manufacturing nebuliser aperture plates25 Jun 2026US 2026/0176766 A1Stamford Devices Limited
- Resin material treatment method, and compositions for the same25 Jun 2026US 2026/0176767 A1Okuno Chemical Industries Co., Ltd.
- Method for providing a conductive surface on a non-conductive polymeric surface19 Mar 2026US 2026/0078495 A1Cirrus Materials Science Ltd
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Catalyst for electroless deposition of metals274US 3,937,857 AAMP Incorporated · 1976
- Catalysts for electroless deposition of metals on comparatively low-temperature polyolefin and polyester substrates274US 4,006,047 AAMP Incorporated · 1977
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996