C23C 14/048
Using irradiation by energy or particles
Official title: {using irradiation by energy or particles}
C23C14/048 (Using irradiation by energy or particles) appears on 238 US grants and 259 published applications in this corpus.
Search patents in C23C- Granted patents
- 238
- Published applications
- 259
- Assignees
- 166
- Inventors
- 539
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 1 |
| 2002 | 4 | 10 |
| 2003 | 10 | 10 |
| 2004 | 11 | 13 |
| 2005 | 7 | 8 |
| 2006 | 4 | 12 |
| 2007 | 4 | 1 |
| 2008 | 4 | 11 |
| 2009 | 4 | 28 |
| 2010 | 7 | 12 |
| 2011 | 10 | 11 |
| 2012 | 12 | 15 |
| 2013 | 20 | 12 |
| 2014 | 10 | 7 |
| 2015 | 12 | 13 |
| 2016 | 6 | 5 |
| 2017 | 6 | 13 |
| 2018 | 5 | 8 |
| 2019 | 5 | 10 |
| 2020 | 8 | 10 |
| 2021 | 9 | 14 |
| 2022 | 9 | 10 |
| 2023 | 8 | 13 |
| 2024 | 8 | 8 |
| 2025 | 10 | 1 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Laser induced forward transfer of 2D materials31 Mar 2026US 12,590,372 B2Bar-Ilan University
- Fabricating equipment for semiconductor device and method for fabricating semiconductor device17 Feb 2026US 12,557,261 B2Samsung Electronics Co., Ltd.
- Method of coupling semiconductor dice and corresponding semiconductor device13 Jan 2026US 12,525,512 B2STMicroelectronics S,r.l.
- Method for layer-wise manufacturing of a shaped body30 Dec 2025US 12,509,400 B2IO Tech Group Ltd.
- Techniques and apparatus for selective shaping of mask features using angled beams16 Sep 2025US 12,417,923 B2APPLIED Materials.Inc.
- Carrier for laser induced forward transfer and transfer apparatus comprising the same13 Aug 2026US 2026/0233341 A1Nexperia B. V.
- Deposition apparatus, method for depositing, method for packaging a die in a chip package30 Jul 2026US 2026/0218369 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Fabricating equipment for semiconductor device and method for fabricating semiconductor device4 Jun 2026US 2026/0156798 A1Samsung Electronics Co., Ltd.
- Printing process using particles of non-amorphous carbon allotropes19 Jun 2025US 2025/0196510 A1Heliosonic GmbH
- Method and device for transferring components19 Dec 2024US 2024/0417189 A1EV Group E. Thallner GmbH
Most cited
By later US patents
- Ultraviolet laser system and method for forming vias in multi-layered targets258US 5,593,606 AElectro Scientific Industries, Inc. · 1997
- Method of molecular-scale pattern imprinting at surfaces209US 6,319,566 B12001
- Method of forming an organic electroluminescent display panel207US 5,688,551 AEastman Kodak Company · 1997
- Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets146US 5,841,099 AElectro Scientific Industries, Inc. · 1998
- Laser system and method for plating vias141US 5,614,114 AElectro Scientific Industries, Inc. · 1997