C09J 201/08
Carboxyl groups
C09J201/08 (Carboxyl groups) appears on 22 US grants and 24 published applications in this corpus.
Search patents in C09J- Granted patents
- 22
- Published applications
- 24
- Assignees
- 25
- Inventors
- 82
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 0 |
| 2014 | 0 | 3 |
| 2015 | 0 | 1 |
| 2016 | 0 | 2 |
| 2017 | 2 | 3 |
| 2018 | 1 | 1 |
| 2019 | 1 | 0 |
| 2020 | 2 | 7 |
| 2021 | 1 | 2 |
| 2022 | 2 | 1 |
| 2023 | 3 | 0 |
| 2024 | 2 | 0 |
| 2025 | 2 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Photomask, method of fabricating a photomask, and method of fabricating a semiconductor structure using a photomask2 Sep 2025US 12,405,527 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Adhesive layer, near-infrared shielding film, laminated structure, stacked body and adhesive agent composition14 Jan 2025US 12,195,350 B2Sumitomo Metal Mining Co., Ltd.
- Aqueous adhesive for inorganic materials23 Jul 2024US 12,043,766 B2Mag-Isover K.K.
- Latex composition30 Jan 2024US 11,884,761 B2Zeon Corporation
- Thermally crosslinkable composition29 Aug 2023US 11,739,239 B2Sunstar Engineering Inc.
- Temporary adhesive, and method for manufacturing semiconductor wafer laminate using the temporary adhesive14 Aug 2025US 2025/0257251 A1Daicel Corporation
- Photomask, method of fabricating a photomask, and method of fabricating a semiconductor structure using a photomask1 Sep 2022US 2022/0276552 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Adhesive compound in particular for curved surfaces17 Jun 2021US 2021/0179899 A1Tesa SE
- Aqueous adhesive for inorganic materials4 Feb 2021US 2021/0032509 A1Mag-Isover K.K.
- Adhesive composition, adhesive layer, and adhesive sheet5 Nov 2020US 2020/0347277 A1Nitto Denko Corporation
Most cited
By later US patents
- Curable resin composition and its use30US 6,090,897 ANippon Shokubai Co., Ltd. · 2000
- Stable waterborne polymer compositions containing poly(alkylenimines)25US 6,649,679 B1Eastman Chemical Company · 2003
- Two-pack crosslinking aqueous adhesive12US 5,739,201 ASunstar Giken Kabushiki Kaisha · 1998
- System for thermoplastic cross-linking adhesives, their preparation and a corresponding method of gluing4US 5,080,746 ASociete Chimique des Charbonnages S.A. · 1992
- Photomask, method of fabricating a photomask, and method of fabricating a semiconductor structure using a photomask2US 11,340,524 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2022