C09J 201/06
Containing oxygen atoms
Official title: containing oxygen atoms {(C09J201/025 takes precedence)}
C09J201/06 (Containing oxygen atoms) appears on 55 US grants and 64 published applications in this corpus.
Search patents in C09J- Granted patents
- 55
- Published applications
- 64
- Assignees
- 58
- Inventors
- 207
- Latest grant
- 9 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 1 |
| 2003 | 3 | 2 |
| 2004 | 3 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 0 | 1 |
| 2011 | 1 | 2 |
| 2012 | 0 | 1 |
| 2013 | 3 | 1 |
| 2014 | 2 | 3 |
| 2015 | 0 | 6 |
| 2016 | 4 | 2 |
| 2017 | 3 | 7 |
| 2018 | 3 | 6 |
| 2019 | 3 | 3 |
| 2020 | 5 | 8 |
| 2021 | 4 | 2 |
| 2022 | 2 | 4 |
| 2023 | 3 | 4 |
| 2024 | 3 | 0 |
| 2025 | 3 | 3 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Photo-crosslinkable pressure-sensitive adhesive and use thereof9 Dec 2025US 12,492,327 B2Nitto Denko Corporation
- Photomask, method of fabricating a photomask, and method of fabricating a semiconductor structure using a photomask2 Sep 2025US 12,405,527 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Adhesive layer, near-infrared shielding film, laminated structure, stacked body and adhesive agent composition14 Jan 2025US 12,195,350 B2Sumitomo Metal Mining Co., Ltd.
- Wiring member6 Aug 2024US 12,057,247 B2Autonetworks Technologies, Ltd.
- Aqueous adhesive for inorganic materials23 Jul 2024US 12,043,766 B2Mag-Isover K.K.
- Temporary adhesive, and method for manufacturing semiconductor wafer laminate using the temporary adhesive14 Aug 2025US 2025/0257251 A1Daicel Corporation
- Adhesive composition3 Jul 2025US 2025/0215293 A1Shin-Etsu Polymer Co., Ltd.
- Adhesive composition19 Jun 2025US 2025/0197686 A1Shin-Etsu Polymer Co., Ltd.
- Polymer film with adhesive layer, laminate, and method for producing laminate7 Dec 2023US 2023/0392053 A1FUJIFILM Corporation
- Base material/adhesive layer integrated sheet for flexible device and method of producing flexible device21 Sep 2023US 2023/0295470 A1Furukawa Electric Co., Ltd.
Most cited
By later US patents
- Biomimetic compounds and synthetic methods therefor58US 7,622,533 B2Nerites Corporation · 2009
- Circuit connecting material, and structure and method of connecting circuit terminal47US 6,777,464 B1Hitachi Chemical Company, Ltd. · 2004
- Hot-melt adhesive composition comprising acidic polymer and basic polymer blends34US 6,800,680 B23M Innovative Properties Company · 2004
- Curable resin composition and its use30US 6,090,897 ANippon Shokubai Co., Ltd. · 2000
- Hot-melt adhesive compositions comprising acidic polymer and basic polymer blends30US 6,720,387 B13M Innovative Properties Company · 2004