Adhesive composition
AssigneeShin-Etsu Polymer Co., Ltd.
InventorsShiori MOMMA, Kazuyoshi YOSHIDA, Wataru KATAGIRI
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Abstract
The present invention provides a resin composition for forming a low-dielectric adhesive layer that has 5G compatible good electrical properties (low-dielectric properties), ensures high adhesiveness, and also has a small linear thermal expansion coefficient (CTE), and an adhesive composition containing the resin composition. The adhesive composition contains a maleimide resin (A) having a molecular weight of 1,000 or more, a benzoxazine resin (B), and an alkenyl resin (C) having a 1-alkenyl group, and a mixing ratio between the benzoxazine resin (B) and the alkenyl resin (C) in the resin composition is 1:10 to 10:1.
Claims19
An adhesive composition comprising a resin composition comprising a maleimide resin (A) having a molecular weight of 1,000 or more, a benzoxazine resin (B), and an alkenyl resin (C) having a 1-alkenyl group,
- wherein a mixing ratio between the benzoxazine resin (B) and the alkenyl resin (C) in the resin composition is 1:10 to 10:1.
Dependencies are inferred from the claim text.