Adhesive composition
AssigneeShin-Etsu Polymer Co., Ltd.
InventorsShiori MOMMA, Kazuyoshi YOSHIDA, Wataru KATAGIRI
Life of this patent
Estimating the term…
Abstract
Provided are a resin composition for forming a low dielectric adhesive layer that has good 5G-compatible electrical properties (low dielectric properties), ensures high adhesiveness, suppresses the generation of bubbles, and has a small coefficient of linear thermal expansion (CTE); and an adhesive composition containing the resin composition. The adhesive composition contains a resin composition containing a maleimide resin having a molecular weight of 1000 or more and a benzoxazine resin, and the benzoxazine resin has a site represented by formula (1). In formula (1), R represents a hydrocarbon group having 4 or more carbon atoms. The hydrocarbon group optionally has an unsaturated binding site.
Claims17
An adhesive composition comprising a resin composition containing a maleimide resin having a molecular weight of 1,000 or more and a benzoxazine resin,
- wherein the benzoxazine resin has a site represented by formula (1):
- wherein R represents a hydrocarbon group having 4 or more carbon atoms, the hydrocarbon group optionally having an unsaturated binding site.
Dependencies are inferred from the claim text.