C09J 179/08
Polyimides
Official title: Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
C09J179/08 (Polyimides) appears on 351 US grants and 379 published applications in this corpus.
Search patents in C09J- Granted patents
- 351
- Published applications
- 379
- Assignees
- 192
- Inventors
- 1,028
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 11 | 0 |
| 1994 | 11 | 0 |
| 1995 | 2 | 0 |
| 1996 | 7 | 0 |
| 1997 | 11 | 0 |
| 1998 | 10 | 0 |
| 1999 | 11 | 0 |
| 2000 | 7 | 0 |
| 2001 | 15 | 2 |
| 2002 | 8 | 5 |
| 2003 | 4 | 8 |
| 2004 | 9 | 10 |
| 2005 | 5 | 9 |
| 2006 | 6 | 9 |
| 2007 | 4 | 11 |
| 2008 | 3 | 16 |
| 2009 | 4 | 18 |
| 2010 | 9 | 23 |
| 2011 | 6 | 17 |
| 2012 | 16 | 17 |
| 2013 | 14 | 18 |
| 2014 | 10 | 7 |
| 2015 | 10 | 12 |
| 2016 | 11 | 21 |
| 2017 | 12 | 23 |
| 2018 | 16 | 18 |
| 2019 | 19 | 11 |
| 2020 | 12 | 15 |
| 2021 | 15 | 17 |
| 2022 | 6 | 19 |
| 2023 | 7 | 16 |
| 2024 | 17 | 23 |
| 2025 | 10 | 24 |
| 2026 | 12 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- All-aromatic liquid-crystalline homo-polyimides with aromatic endgroups and crosslinked products therefrom15 Sep 2026US 12,734,747 B2The United States of America as represented by the Secretary of the Air Force
- All-aromatic liquid-crystalline homo-polyimides with aromatic endgroups and crosslinked products therefrom15 Sep 2026US 12,734,748 B2The United States of America as represented by the Secretary of the Air Force
- Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing14 Jul 2026US 12,685,086 B2Shin-Etsu Chemical Co., Ltd.
- Resin composition and article made therefrom30 Jun 2026US 12,668,717 B1Elite Material Co., Ltd.
- Provisional fixation material and method for producing electronic component16 Jun 2026US 12,655,334 B2Sekisui Chemical Co., Ltd.
- Thermosetting maleimide resin composition, sheet-like or film-like composition using same, adhesive agent composition, primer composition, composition for substrates, coating material composition, and semiconductor device17 Sep 2026US 2026/0275038 A1Nippon Kayaku Kabushiki Kaisha
- Resin composition, film, film set, optical waveguide, opto-electric composite substrate, and electronic component30 Jul 2026US 2026/0218020 A1Sumitomo Bakelite Co., Ltd.
- Curable resin composition23 Jul 2026US 2026/0209565 A1Shin-Etsu Chemical Co., Ltd.
- One-part adhesive for thermoplastic urethanes16 Jul 2026US 2026/0201221 A1Lord Corporation
- Insulated wire, coil and electronic or electrical device26 Mar 2026US 2026/0088198 A1Well Ascent Electronic (Ganzhou) Co., Ltd.
Most cited
By later US patents
- Insulating adhesive tape, and lead frame and semiconductor device employing the tape253US 5,406,124 AMitsui Toatsu Chemicals, Inc. · 1995
- Polyarylether ketone imide adhesives118US 10,011,685 B2The Boeing Company · 2018
- Paper product comprising adhesively joined plies88US 5,858,554 AThe Procter & Gamble Company · 1999
- Fiber optic connector sub-assemblies and related methods81US 9,581,768 B1Corning Optical Communications LLC · 2017
- Cellulosic composite70US 8,377,564 B2Johns Manville · 2013