Temporary adhesion method, device wafer processing method, laminate for temporary adhesion, and laminate for device wafer processing
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTamotsu Oowada, Shohei Tagami, Mitsuo Muto, Masahito Tanabe
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Abstract
A temporary adhesion method for temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface including a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface, wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer including a dry adhesive fiber structure having a plurality of pillar structures.
Claims7
A temporary adhesion method, the method comprising temporarily adhering a wafer to a support via a temporary adhesive layer, the wafer having a first main surface comprising a circuit and a second main surface to be processed, the second main surface being located on an opposite side to the first main surface,
- wherein a temporary adhesion between the first main surface of the wafer and the support is performed via the temporary adhesive layer comprising a dry adhesive fiber structure having a plurality of pillar structures each having a main part and a tip having an upper end on top of the main part in which the width of the tip is enlarged toward the end directed upward,
- wherein a ratio of cross sectional areas of the tip to the main part of each of the plurality of the pillar structures is 1:1 where the tip borders the main part and 2:1 at the top of the tip,
- wherein each of the plurality of the pillar structures has a height of 1 μm to 1 mm, has a bottom surface having a diameter of 10 nm to 100 μm, and the tip of each of the plurality of the pillar structures has a diameter of 20 nm to 200 μm,
- wherein the plurality of the pillar structures is formed at a density of 100/mm2 or more and 5000/mm2 or less,
- wherein a structure in which the plurality of the pillar structures is formed with a silicone-modified polyimide is used as the dry adhesive fiber structure, and
- wherein a structure with a capability of a repeated temporary adhesion is used as the temporary adhesive layer.
A laminate for temporary adhesion used for temporarily adhering a wafer to a support via a temporary adhesive layer, the laminate comprising:
- the support;
- and
- the temporary adhesive layer formed on the support,
- wherein the temporary adhesive layer comprises a dry adhesive fiber structure having a plurality of pillar structures each having a main part and a tip having an upper end on top of the main part in which the width of the tip is enlarged toward the end directed upward,
- wherein a ratio of cross sectional areas of the tip to the main part of each of the plurality of the pillar structures is 1:1 where the tip borders the main part and 2:1 at the top of the tip,
- wherein each of the plurality of the pillar structures has a height of 1 μm to 1 mm, has a bottom surface having a diameter of 10 nm to 100 μm, and the tip of each of the plurality of the pillar structures has a diameter of 20 nm to 200 μm,
- wherein the plurality of the pillar structures is formed at a density of 100/mm2 or more and 5000/mm2 or less,
- wherein the plurality of the pillar structures is formed with a silicone-modified polyimide, and
- wherein the temporary adhesive layer has a capability of a repeated temporary adhesion.
Dependencies are inferred from the claim text.