Thermosetting maleimide resin composition, sheet-like or film-like composition using same, adhesive agent composition, primer composition, composition for substrates, coating material composition, and semiconductor device

Abstract

The purpose of the present invention is to provide a thermosetting maleimide resin composition that provides a cured product having a high glass transition temperature (Tg), excellent dielectric properties, and excellent adhesiveness with respect to metal foils, and that has fine compatibility and is cured uniformly without any post-curing nonuniformity. The thermosetting maleimide resin composition contains (I) a bismaleimide compound and (II) a reaction accelerator. The (I) bismaleimide compound has a cyclic imide bond obtained by reacting an aromatic diamine (A) represented by formula (1), a tetrabasic acid dianhydride (C), and maleic acid anhydride. In formula (1), each R1 independently represents a hydrogen atom, a straight-chain or branched alkyl group having 1-6 carbon atoms, a halogen atom, a hydroxy group, or a straight-chain or branched alkoxy group having 1-6 carbon atoms. Each 1 independently represents an integer of 1-4.

Dependencies are inferred from the claim text.