C08G 73/106
Containing silicon
Official title: {containing silicon}
C08G73/106 (Containing silicon) appears on 408 US grants and 302 published applications in this corpus.
Search patents in C08G- Granted patents
- 408
- Published applications
- 302
- Assignees
- 153
- Inventors
- 911
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 4 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 8 | 0 |
| 1987 | 9 | 0 |
| 1988 | 6 | 0 |
| 1989 | 17 | 0 |
| 1990 | 16 | 0 |
| 1991 | 16 | 0 |
| 1992 | 15 | 0 |
| 1993 | 18 | 0 |
| 1994 | 7 | 0 |
| 1995 | 6 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 10 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 0 |
| 2002 | 8 | 6 |
| 2003 | 4 | 7 |
| 2004 | 7 | 5 |
| 2005 | 3 | 4 |
| 2006 | 6 | 6 |
| 2007 | 0 | 10 |
| 2008 | 3 | 3 |
| 2009 | 2 | 12 |
| 2010 | 6 | 13 |
| 2011 | 11 | 14 |
| 2012 | 7 | 14 |
| 2013 | 12 | 11 |
| 2014 | 13 | 9 |
| 2015 | 12 | 13 |
| 2016 | 12 | 14 |
| 2017 | 3 | 14 |
| 2018 | 10 | 27 |
| 2019 | 15 | 29 |
| 2020 | 17 | 20 |
| 2021 | 20 | 22 |
| 2022 | 7 | 11 |
| 2023 | 12 | 9 |
| 2024 | 9 | 16 |
| 2025 | 12 | 7 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Polyimide precursor composition and optical multilayer structure formed using the same19 May 2026US 12,630,739 B2SK Innovation Co., Ltd.
- Polyimide precursor, resin composition including, and polyimide formed from such precursor, and use of the polyimide10 Mar 2026US 12,570,852 B2Daxin Materials Corporation
- Laminate and manufacturing method of semiconductor device27 Jan 2026US 12,534,399 B2Toray Industries, Inc.
- Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device21 Oct 2025US 12,451,367 B2
- Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device23 Sep 2025US 12,422,750 B2FUJIFILM Corporation
- Soluble polymer compound, method for producing soluble polymer compound, resin composition, resin composition film, cured film, and electronic component23 Jul 2026US 2026/0211329 A1Toray Industries, Inc.
- Polyimide materials for glass substrate modification2 Jul 2026US 2026/0184854 A1Eternal Materials Co., Ltd.
- Prepolymer, resin composition including the same and article made therefrom2 Jul 2026US 2026/0184895 A1Elite Electronic Material (Kunshan) Co., Ltd.
- Modified substrate and methods for manufacturing the same2 Jul 2026US 2026/0191065 A1Eternal Materials Co., Ltd.
- Photosensitive composition, cured product, electronic component, and method for producing cured product19 Mar 2026US 2026/0079397 A1Toray Industries, Inc.
Most cited
By later US patents
- Aerogel metallic compositions1,501US 7,071,287 B2Aspen Aerogels, Inc. · 2006
- Negative birefringent polyimide films102US 5,344,916 AThe University of Akron · 1994
- Siloxane-containing polymers94US 4,395,527 AM&T Chemicals Inc. · 1983
- Siloxane-containing polymers93US 4,480,009 AM&T Chemicals Inc. · 1984
- Siloxane-containing polymers93US 4,499,149 AM&T Chemicals Inc. · 1985