Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device

A method of manufacturing a cured film, comprising:

• a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition;
• a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern;
• and
• a second exposure step of exposing the pattern with light including light having a wavelength in a range of 190 nm to 550 nm and different from a wavelength of light used in the first exposure step,
• wherein the photocurable resin composition contains
• at least one resin selected from the group consisting of polyimide and polybenzoxazole,
• a photosensitive compound A having a sensitivity to an exposure wavelength in the first exposure step, and
• a photosensitive compound B having no sensitivity to the exposure wavelength in the first exposure step and having a sensitivity to an exposure wavelength in the second exposure step,
• where the photosensitive compound A is a compound that changes a solubility of the photocurable film in the developing solution in the first exposure step, and at least one of the following condition 1 or condition 2 is satisfied;
• the condition 1:
• the resin in the photocurable resin composition contains a group in which a bonding reaction with another group is promoted due to photosensitization of the photosensitive compound B in the second exposure step,
• the condition 2:
• the photocurable resin composition further contains a crosslinking agent having a group in which a bonding reaction with another group is promoted due to photosensitization of the photosensitive compound B in the second exposure step.