Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor device

A method for manufacturing a semiconductor device including an encapsulation molded body, wherein the encapsulation molded body comprises a lead frame including a die pad and an inner lead and adapted to be conveyed on a stage during the manufacture of the semiconductor device, a semiconductor element, a wire and an encapsulation layer, the method comprising:

• providing a temporary protective film including:
• a support film having a first surface and a second surface;
• an adhesive layer provided on the first surface of the support film;
• and
• a non-adhesive layer provided on the second surface of the support film;
• attaching the temporary protective film to a surface of the lead frame in such a direction that the adhesive layer of the temporary protective film is in contact with the lead frame to obtain a temporary protective film-attached lead frame;
• mounting the semiconductor element to a surface of the die pad on an opposite side from the temporary protective film;
• providing a wire connecting the semiconductor element and the inner lead;
• forming the encapsulation layer encapsulating the semiconductor element, the temporary protective film-attached lead frame, and the wire to obtain a temporary protective film-attached encapsulation molded body;
• conveying the temporary protective film-attached lead frame by sliding the temporary protective film-attached encapsulation molded body on the stage, wherein the non-adhesive layer of the temporary protective film provides a contact surface with the stage during the conveyance;
• and
• detaching the temporary protective film from the temporary protective film-attached encapsulation molded body to obtain the encapsulation molded body,
• wherein the temporary protective film-attached lead frame is conveyed on the stage with conveyance failure being suppressed before detaching the temporary protective film from the temporary protective film-attached encapsulation molded body,
• wherein the non-adhesive layer has a thickness of 10 μm or less, and
• wherein the contact surface of the non-adhesive layer has a surface roughness of 0.1 μm or more, as measured by a laser microscope under such a condition that a magnification ratio of an object lens is 50 times, and is thereby configured to suppress the conveyance failure on the stage.