Modified substrate and methods for manufacturing the same
AssigneeEternal Materials Co., Ltd.
InventorsMeng-Yen CHOU, CHIA-JUNG HSU, CHENG-HUNG CHIANG, CHUNG-CHIEN HOU
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AssigneeEternal Materials Co., Ltd.
InventorsMeng-Yen CHOU, CHIA-JUNG HSU, CHENG-HUNG CHIANG, CHUNG-CHIEN HOU
Estimating the term…
The present invention provides a modified substrate, which comprises a substrate, a polyimide layer disposed on at least one of the surface of the substrate, and a patterned conductive material, wherein the patterned conductive material is disposed on the polyimide layer. The polyimide layer improves the adhesion of the conductive material to the substrate. The present invention also provides a method of producing a modified substrate, which comprises heating the substrate at a temperature of about 150° C. to about 350° C. to cure a polyimide precursor into polyimide to obtain a modified substrate. The present invention further provides use of a modified substrate as a glass intermediate layer, silicon intermediate layer or an IC carrier.
A modified substrate, comprising:
A method for manufacturing a modified substrate, comprising:
Dependencies are inferred from the claim text.