C08G 59/688
Containing phosphorus
Official title: {containing phosphorus}
C08G59/688 (Containing phosphorus) appears on 217 US grants and 236 published applications in this corpus.
Search patents in C08G- Granted patents
- 217
- Published applications
- 236
- Assignees
- 136
- Inventors
- 652
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 10 | 0 |
| 1983 | 7 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 7 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 3 |
| 2002 | 3 | 0 |
| 2003 | 4 | 3 |
| 2004 | 2 | 11 |
| 2005 | 4 | 10 |
| 2006 | 1 | 5 |
| 2007 | 3 | 5 |
| 2008 | 7 | 7 |
| 2009 | 3 | 11 |
| 2010 | 2 | 9 |
| 2011 | 4 | 11 |
| 2012 | 8 | 5 |
| 2013 | 5 | 6 |
| 2014 | 5 | 7 |
| 2015 | 6 | 10 |
| 2016 | 4 | 10 |
| 2017 | 6 | 10 |
| 2018 | 10 | 7 |
| 2019 | 5 | 11 |
| 2020 | 7 | 14 |
| 2021 | 11 | 13 |
| 2022 | 8 | 14 |
| 2023 | 8 | 14 |
| 2024 | 6 | 18 |
| 2025 | 8 | 12 |
| 2026 | 4 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- One component polymerizable composition for trickle impregnation1 Sep 2026US 12,723,129 B2Huntsman Advanced Materials (Switzerland) GmbH
- Method for producing polymer4 Aug 2026US 12,698,361 B2Nissan Chemical Corporation
- Non-electroconductive flux, connected structure, and method for producing connected structure31 Mar 2026US 12,589,452 B2Sekisui Chemical Co., Ltd.
- Polymer resin compound, method for producing same, and photosensitive resin composition comprising same17 Mar 2026US 12,577,393 B2LG Chem.Ltd.
- Powder coating material2 Dec 2025US 12,486,407 B2Sumitomo Bakelite Co., Ltd.
- Curable resin and methods for producing curable resin intermediate, curable resin, curable resin composition, and cured product10 Sep 2026US 2026/0265446 A1Nippon Shokubai Co., Ltd.
- Sealing resin composition and semiconductor device20 Aug 2026US 2026/0242536 A1Sumitomo Bakelite Co., Ltd.
- Epoxy resin composition for encapsulation of semiconductor devices and semiconductor device encapsulated using the same13 Aug 2026US 2026/0234320 A1Samsung SDI.Co., Ltd.
- Thermosetting maleimide resin composition for stress-relief layer for glass-core substrate and printed wiring board including the same30 Jul 2026US 2026/0218021 A1Shin-Etsu Chemical Co., Ltd.
- Epoxy resin composition for encapsulation of semiconductor devices and semiconductor device encapsulated using the same11 Jun 2026US 2026/0159637 A1Samsung SDI.Co., Ltd.
Most cited
By later US patents
- Process for reacting a phenol with a vicinal epoxy compound in the presence of phosphorus or carbon containing acid, ester or acid ester77US 3,948,855 AThe Dow Chemical Company · 1976
- Process for coating substrates with high molecular weight epoxy resins55US 3,931,109 AThe Dow Chemical Company · 1976
- Process for the preparation of thermoplastic poly(hydroxy ethers)55US 5,401,814 AThe Dow Chemical Company · 1995
- Latent catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids54US 4,048,141 AThe Dow Chemical Company · 1977
- Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used35US 4,719,502 AKabushiki Kaisha Toshiba · 1988