Epoxy resin composition for encapsulation of semiconductor devices and semiconductor device encapsulated using the same

An epoxy resin composition for encapsulation of semiconductor devices, the epoxy resin composition comprising:

• an epoxy resin;
• a curing agent;
• an inorganic filler;
• and
• a curing catalyst;
• wherein the epoxy resin comprises an epoxy resin represented by Formula 1:
• where R1 to R12 each independently comprises hydrogen, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C6 to C30 aryloxy group, a substituted or unsubstituted C3 to C30 heteroaryl group, a substituted or unsubstituted C3 to C30 heterocycloalkyl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, or a compound represented by Formula 2,
• at least two of R1 to R12 comprising a compound represented by Formula 2:
• wherein * is a linking site of an element and L11 comprises a substituted or unsubstituted C4 to C10 alkylene group.