Curable resin and methods for producing curable resin intermediate, curable resin, curable resin composition, and cured product
AssigneeNippon Shokubai Co., Ltd.
InventorsNobuaki OTSUKI, Yasuhiro MATSUDA
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Abstract
An object of the present disclosure is to provide a curable resin capable of providing a cured product having excellent adhesion and thermal shock resistance, a method for producing an intermediate from which the curable resin can be synthesized, and a method for producing the curable resin. A method for producing a curable resin intermediate, the method including reacting an epoxy resin having a polydispersity (Mw/Mn) of 2.8 or more with an unsaturated monobasic acid in the presence of benzene or naphthalene with two or more directly bonded hydroxy groups.
Claims10
A method for producing a curable resin intermediate, the method comprising reacting an epoxy resin having a polydispersity (Mw/Mn) of 2.8 or more with an unsaturated monobasic acid in the presence of benzene or naphthalene with two or more directly bonded hydroxy groups.
A curable resin comprising:
- an epoxy resin-derived moiety having a structure in which an epoxy group of the epoxy resin is ring-opened;
- an unsaturated monobasic acid residue bonded to a carbon atom of the ring-opened moiety derived from the epoxy group;
- and
- a polybasic acid anhydride residue bonded to an oxygen atom of the ring-opened moiety derived from the epoxy group, wherein
- the epoxy resin-derived moiety has a polydispersity (Mw/Mn) of 2.8 or more, and
- the curable resin contains benzene or naphthalene with two or more directly bonded hydroxy groups.
Dependencies are inferred from the claim text.