Back to results
US 2026/0242536 A1Published application
Sealing resin composition and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsMasahiro IWAI, Yusuke TANAKA
Life of this patent
Estimating the term…
Abstract
The sealing resin composition of the present invention contains an epoxy resin (A) and a curing agent (B) including a phenolic curing agent obtained from a plant-derived raw material.
Claims12
A sealing resin composition comprising:
- (A) an epoxy resin;
- and
- (B) a curing agent including a phenolic curing agent obtained from a plant-derived raw material.
Dependencies are inferred from the claim text.