Epoxy resin composition, and resin-sealed semiconductor device in which this composition is used
AssigneeKabushiki Kaisha Toshiba
InventorsHirotoshi Ikeya, Michiya Higashi
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Abstract
An epoxy resin composition for sealing, and a resin-sealed type semiconductor device in which this composition is used, of outstanding heat cycle resistance, humidity resistance and laser marking characteristics, can be obtained by using a combination of an organic phosphine compound and a metal complex dye. The epoxy resin composition, characterized in that it consists of epoxy resin, a curing agent having at least 2 phenolic hydroxyl groups per molecule, an organic phosphine compound and a metal complex dye; and to a resin-sealed type semiconductor device characterized in that it is sealed with this composition.
Claims11
A resin-sealed type semiconductor device, in which the semiconductor element is sealed with resin, characterized in that the said resin is an epoxy resin composition comprising an epoxy resin, a curing agent having at least two phenolic hydroxyl groups per molecule, an organic phosphine compound and a metal complex dye.
Dependencies are inferred from the claim text.