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US 3,931,109 AGranted
Process for coating substrates with high molecular weight epoxy resins
AssigneeThe Dow Chemical Company
InventorPatrick Henry Martin
Life of this patent
Estimating the term…
Abstract
Substrates are coated with relatively high molecular weight epoxy resin coatings by applying to a substrate a mixture comprising: A. a relatively low molecular weight epoxy resin such as the diglycidyl ether of bisphenol A, B. a phenolic hydroxyl-containing compound such as bisphenol A and C. a catalyst for effecting a reaction between (A) and (B), and Subjecting the coated substrate to a temperature of 120.degree. to 300.degree.C.
Claims8
An epoxy resin coating composition comprising in dispersed form
- 1. a liquid epoxy resin having more than one 1,2-epoxy groups
- 2.
Dependencies are inferred from the claim text.