C08G 59/686
Containing nitrogen
Official title: {containing nitrogen}
C08G59/686 (Containing nitrogen) appears on 626 US grants and 721 published applications in this corpus.
Search patents in C08G- Granted patents
- 626
- Published applications
- 721
- Assignees
- 365
- Inventors
- 1,979
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 2 | 0 |
| 1978 | 8 | 0 |
| 1979 | 3 | 0 |
| 1980 | 9 | 0 |
| 1981 | 6 | 0 |
| 1982 | 5 | 0 |
| 1983 | 9 | 0 |
| 1984 | 5 | 0 |
| 1985 | 13 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 15 | 0 |
| 1989 | 13 | 0 |
| 1990 | 21 | 0 |
| 1991 | 18 | 0 |
| 1992 | 14 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 14 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 1 |
| 2002 | 12 | 8 |
| 2003 | 9 | 20 |
| 2004 | 7 | 11 |
| 2005 | 6 | 8 |
| 2006 | 7 | 15 |
| 2007 | 3 | 16 |
| 2008 | 6 | 6 |
| 2009 | 7 | 9 |
| 2010 | 8 | 26 |
| 2011 | 10 | 20 |
| 2012 | 7 | 28 |
| 2013 | 10 | 19 |
| 2014 | 16 | 21 |
| 2015 | 12 | 25 |
| 2016 | 18 | 30 |
| 2017 | 26 | 36 |
| 2018 | 23 | 34 |
| 2019 | 27 | 44 |
| 2020 | 29 | 52 |
| 2021 | 27 | 48 |
| 2022 | 22 | 55 |
| 2023 | 29 | 45 |
| 2024 | 25 | 50 |
| 2025 | 29 | 59 |
| 2026 | 20 | 35 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- One component polymerizable composition for trickle impregnation1 Sep 2026US 12,723,129 B2Huntsman Advanced Materials (Switzerland) GmbH
- Shape memory poly(β-hydroxythioether) foams rapidly produced from multifunctional epoxides and thiols18 Aug 2026US 12,708,892 B2Ohio University
- Method for producing product, adhesive composition and foaming adhesive sheet11 Aug 2026US 12,703,809 B2Dai Nippon Printing Co.Ltd.
- Thermosetting composition, cured product, device, and method for manufacturing the device11 Aug 2026US 12,703,814 B2Panasonic Intellectual Property Management Co., Ltd.
- Curable resin film, film material for semiconductor device production, curable resin composition for semiconductor device production, and method for producing semiconductor device4 Aug 2026US 12,702,047 B2
- Epoxy resin composition particle, tablet, and method for producing columnar tablet1 Oct 2026US 2026/0297243 A1Sumitomo Bakelite Co., Ltd.
- Heat-curing epoxy resin composition having high storage stability24 Sep 2026US 2026/0286200 A1Sika Technology AG
- Adhesive17 Sep 2026US 2026/0275175 A1Lohmann GmbH & Co. KG
- One component composition based on epoxy resins10 Sep 2026US 2026/0265592 A1Henkel AG & Co. KGaA
- Use of hydroxy substituted urones as cure accelerators3 Sep 2026US 2026/0258191 A1Hexcel Composites Limited
Most cited
By later US patents
- Epoxy resin and polythiol composition66US 5,430,112 AAjinomoto Co., Inc. · 1995
- Process for preparing catalytic solutions of sulfonium salts50US 4,179,400 AW. R. Grace & Co. · 1979
- Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst41US 6,486,256 B13M Innovative Properties Company · 2002
- Acid catalyzed, toughened epoxy adhesives37US 4,846,905 AMinnesota Mining and Manufacturing Company · 1989
- Powder coating of epoxy resin, imidazole-epoxy resin catalyst or polyamine, polyamine powder and amine scavenger37US 6,218,483 B1Rohm and Haas Company · 2001