Epoxy resin and polythiol composition
AssigneeAjinomoto Co., Inc.
InventorsHiroyuki Sakata, Tadahiko Yokota, Kenichi Mori, Kiyomiki Hirai, Koji Takeuchi, Toshihiko Hatajima
Life of this patent
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Abstract
Epoxy resin compositions which contain (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator which is (i) a solid dispersion-type amine adduct latent curing accelerator or (ii) the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule, exhibit excellent curability at relatively low heating temperatures as well as a long working life.
Claims15
An epoxy resin composition, consisting essentially of (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator selected from the group consisting of (i) a solid dispersion-type amine-epoxy adduct latent curing accelerator and (ii) a product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule.
A cured epoxy resin, prepared by heating an epoxy resin composition consisting essentially of (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator selected from the group consisting of (i) a solid dispersion-type amine-epoxy adduct latent curing accelerator and (ii) a product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule.
Dependencies are inferred from the claim text.