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US 12,703,814 B2Granted
Thermosetting composition, cured product, device, and method for manufacturing the device
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHaruka Fujita, Takashi Saruwatari, Hiroki Shinozaki
Life of this patent
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Abstract
A thermosetting composition according to the present disclosure contains: an epoxy resin (A); a thiol compound (B) having at least two thiol groups per molecule; a radical polymerizable compound (C); a photo radical polymerization initiator (D); and a radical scavenger (E).
Claims14
A thermosetting composition containing:
- an epoxy resin (A);
- a thiol compound (B) having at least two thiol groups per molecule;
- a radical polymerizable compound (C);
- a photo radical polymerization initiator (D);
- a radical scavenger (E);
- and
- a carbodiimide compound (H), wherein:
- a ratio of a thiol group equivalent of the thiol compound (B) to one epoxy equivalent of the epoxy resin (A) is equal to or greater than 0.75 and equal to or less than 10.0,
- a proportion of the radical scavenger (E) with respect to an entirety of the thermosetting composition is equal to or greater than 0.03% by mass and equal to or less than 0.2% by mass, and
- a proportion of the carbodiimide compound (H) with respect to the total of the epoxy resin (A), the thiol compound (B), and the radical polymerizable compound (C) is equal to or less than 15% by mass.
7 more elements
Dependencies are inferred from the claim text.