C08G 59/423
Containing an atom other than oxygen belonging to a functional groups to
Official title: {containing an atom other than oxygen belonging to a functional groups to C08G59/42, carbon and hydrogen}
C08G59/423 (Containing an atom other than oxygen belonging to a functional groups to) appears on 52 US grants and 40 published applications in this corpus.
Search patents in C08G- Granted patents
- 52
- Published applications
- 40
- Assignees
- 45
- Inventors
- 148
- Latest grant
- 1 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 2 | 1 |
| 2008 | 1 | 4 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 1 | 1 |
| 2012 | 4 | 1 |
| 2013 | 1 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 1 |
| 2017 | 2 | 1 |
| 2018 | 2 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 4 |
| 2021 | 1 | 0 |
| 2022 | 2 | 6 |
| 2023 | 1 | 4 |
| 2024 | 0 | 1 |
| 2025 | 4 | 1 |
| 2026 | 0 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof1 Jul 2025US 12,344,758 B2Nissan Chemical Corporation
- Room temperature ionic liquid curing agent11 Mar 2025US 12,247,097 B2Evonik Operations GmbH
- Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition25 Feb 2025US 12,234,318 B2Shengyi Technology Co., Ltd.
- Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board28 Jan 2025US 12,209,160 B2Panasonic Intellectual Property Management Co., Ltd.
- Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound18 Jul 2023US 11,702,578 B2FUJIFILM Corporation
- Cavity forming composition27 Aug 2026US 2026/0250517 A1Nissan Chemical Corporation
- Fully recyclable, dual dynamic bond-based, high-strength epoxy polymer and method for producing the same18 Jun 2026US 2026/0167765 A1Pusan National University Industry-University Cooperation Foundation
- Compositions Comprising Cleavable Crosslinkers11 Jun 2026US 2026/0159639 A13M Innovative Properties Company
- Heat-curable composition, cured article, adhesive agent, and heat-curable composition production method4 Jun 2026US 2026/0152600 A1Kagoshima University
- Epoxy resin composition, resin paste, film-type adhesive, printed wiring board, semiconductor chip package, and electronic device23 Apr 2026US 2026/0109849 A1Asahi Kasei Kabushiki Kaisha
Most cited
By later US patents
- 4,4'-Isopropylidene-bis(3- and 4-phenyleneoxyphthalic anhydride)129US 3,972,902 AGeneral Electric Company · 1976
- Latent catalysts for promoting reaction of epoxides with phenols and/or carboxylic acids54US 4,048,141 AThe Dow Chemical Company · 1977
- Aromatic bis(ether phthalis anhydride) compounds38US 3,956,320 AGeneral Electric Company · 1976
- Aromatic dithio dianhydrides26US 3,933,862 AGeneral Electric Company · 1976
- Aqueous powder paint dispersions24US 6,177,487 B1BASF Coatings GmbH · 2001