Cavity forming composition
AssigneeNissan Chemical Corporation
InventorsKazuhiko KINOSHITA, Tokio NISHITA, Takahiro KISHIOKA
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Abstract
A cavity forming composition suitable for forming a cavity by heating between conductive wiring patterns on a semiconductor substrate, and the like. A cavity forming composition for forming a cavity between conductive wiring patterns on a semiconductor substrate, the cavity forming composition containing: a polymer containing an alicyclic hydrocarbon structural moiety and not containing an aromatic hydrocarbon structural moiety; and a solvent.
Claims8
A cavity forming composition for forming a cavity between conductive wiring patterns on a semiconductor substrate, the cavity forming composition comprising:
- a polymer containing an alicyclic hydrocarbon structural moiety and not containing an aromatic hydrocarbon structural moiety;
- and a solvent.
Dependencies are inferred from the claim text.