US 12,344,758 B2 · Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof

Abstract

A protective film forming composition which has good mask (protection) function against a wet etching liquid and a high dry etching rate during processing of a semiconductor substrate and also has good coverage even in a stepped substrate, and from which a flat film can be formed due to a small difference in film thickness after being embedded; a protective film produced using said composition; a substrate with a resist pattern; and a method for manufacturing a semiconductor device. This protective film forming composition against a wet etching liquid for semiconductors contains an organic solvent and a polymer having, at a terminal thereof, a structure containing at least one pair of two adjacent hydroxyl groups in a molecule. The structure containing two adjacent hydroxyl groups in a molecule may be 1,2-ethanediol structure (A).

Claims21

Dependent claims

A composition for forming a protective film against a wet etching liquid for a semiconductor, comprising:

a polymer having at a terminal thereof a 1,2-ethanediol structure (A);
and
an organic solvent;
wherein the 1,2-ethanediol structure is represented by formula (I):
where:
X is —S—;
Y represents a direct bond or an alkylene group having 1 to 4 carbon atoms which may be substituted;
R2, R3, and R4 each are a hydrogen atom, an alkyl group having 1 to 10 carbon atoms which may be substituted, or an aryl group having 6 to 40 carbon atoms which may be substituted;
and
R2 may form a ring together with R3 or R4;
and
wherein the polymer is a reaction product of a diepoxy compound (B) and a bi- or higher-functional proton generating compound (C) wherein the bi- or higher functional proton generating compound (C) is an acid anhydride.

9 more elements

Dependencies are inferred from the claim text.

Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof

Life of this patent

Chemical solution-resistant protective film forming composition containing polymerization product having diol structure at terminal thereof

Life of this patent

Abstract

Claims21