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US 12,209,160 B2Granted
Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorDaisuke Nii
Life of this patent
Estimating the term…
Abstract
A resin composition contains an epoxy compound and a curing agent. The epoxy compound includes a phosphorus-containing epoxy compound having a phosphorus atom in its molecule. The curing agent includes a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in its molecule.
Claims18
A resin composition comprising an epoxy compound and a curing agent,
- the epoxy compound including a phosphorus-containing epoxy compound having a phosphorus atom in its molecule,
- the curing agent including a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in its molecule.
Dependencies are inferred from the claim text.