Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition

A thermosetting epoxy resin composition, comprising the following components in part by weight:

• Component A:
• 2-10 parts of a phosphorus-containing anhydride, Component B:
• 5-40 parts of a phosphorus-free anhydride, Component C:
• 5-45 parts of an epoxy resin, Component D:
• 40-70 parts of a filler, and Component E:
• 0-15 parts of a phosphorus-containing flame retardant;
• the total part by weight of the Component A, Component B, Component C, Component D and Component E is 100 parts;
• the phosphorus-containing anhydride has a structure represented by Formula I or Formula II as follows:
• wherein R1 and R2 are each independently selected from any one of hydrogen, C1-C5 alkyl, substituted phenyl, unsubstituted phenyl, substituted naphthyl, and unsubstituted naphthyl;
• R3 is selected from any one of hydrogen, C1-C5 alkyl, siloxy and siloxyalkyl;
• X1 and X2 are each independently selected from any one of
• wherein * represents a linkage site of the group;
• R11 and R12 are each independently selected from any one of C1-C5 alkyl, benzoxazinyl, substituted phenyl, unsubstituted phenyl, substituted naphthyl, and unsubstituted naphthyl;
• when the above group contains a substituent, the substituent is a halogen atom or a C1-C5 linear or branched alkyl group;
• wherein the epoxy resin is selected from a bisphenol A epoxy resin, a bisphenol F epoxy resin, a biphenyl epoxy resin, and combinations thereof;
• wherein the epoxy resin of Component C is the only epoxy resin present in the composition;
• and
• wherein the filler is titanium dioxide.