Heat-curable composition, cured article, adhesive agent, and heat-curable composition production method

Abstract

The heat-curable composition according to the present disclosure includes: a first component that contains a siloxane having an epoxy group; and a second component that contains at least one of a phenol having a structure in which a ring-opening functional group (excluding a hydroxy group) that is a functional group having an action of ring-opening the epoxy group is bound to a benzene ring, or an acyclic aliphatic compound having a structure in which the ring-opening functional group is bound to an end.

Dependencies are inferred from the claim text.