C08G 59/304
Containing phosphorus
Official title: {containing phosphorus}
C08G59/304 (Containing phosphorus) appears on 131 US grants and 117 published applications in this corpus.
Search patents in C08G- Granted patents
- 131
- Published applications
- 117
- Assignees
- 73
- Inventors
- 289
- Latest grant
- 25 Feb 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 12 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 4 | 1 |
| 2002 | 1 | 4 |
| 2003 | 6 | 11 |
| 2004 | 4 | 9 |
| 2005 | 6 | 4 |
| 2006 | 6 | 2 |
| 2007 | 3 | 1 |
| 2008 | 1 | 2 |
| 2009 | 0 | 3 |
| 2010 | 2 | 11 |
| 2011 | 2 | 8 |
| 2012 | 7 | 13 |
| 2013 | 11 | 7 |
| 2014 | 7 | 6 |
| 2015 | 5 | 3 |
| 2016 | 1 | 1 |
| 2017 | 4 | 4 |
| 2018 | 1 | 4 |
| 2019 | 2 | 7 |
| 2020 | 5 | 4 |
| 2021 | 6 | 4 |
| 2022 | 1 | 4 |
| 2023 | 1 | 1 |
| 2024 | 5 | 2 |
| 2025 | 2 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition25 Feb 2025US 12,234,318 B2Shengyi Technology Co., Ltd.
- Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board28 Jan 2025US 12,209,160 B2Panasonic Intellectual Property Management Co., Ltd.
- Solvent-less ionic liquid epoxy resin7 May 2024US 11,976,162 B2Arizona Board of Regents on behalf of Arizona State University
- Resin composition, method for forming cured product, and cured product20 Feb 2024US 11,905,388 B2Adeka Corporation
- Phenylphosphine oxide and oxygen stable epoxy polymers and methods of synthesis30 Jan 2024US 11,884,772 B2The University of Southern Mississippi
- Hybrid impregnation process for electric vehicle motor stator using hot melt epoxy-imidazole cure system9 Jul 2026US 2026/0196901 A1
- One-component toughened epoxy adhesives21 Mar 2024US 2024/0093072 A1Ddp Specialty Electronic Materials US, LLC
- Adhesion promoters and compositions for containers and other articles18 Jan 2024US 2024/0018382 A1Swimc LLC
- Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition9 Feb 2023US 2023/0045615 A1Shengyi Technology Co., Ltd.
- Resin composition, method for forming cured product, and cured product8 Sep 2022US 2022/0282059 A1Adeka Corporation
Most cited
By later US patents
- Hydrophilic, highly swellable hydrogels173US 5,331,059 ACassella Aktiengesellschaft · 1994
- Epoxy resin compounds in admixture with glycidyl phosphorus compounds and heterocyclic polyamines37US 5,376,453 ASiemens Aktiengesellschaft · 1994
- Halogen-free resin composition35US 6,900,269 B2Chang Chun Plastics Co., Ltd. · 2005
- Flame retardant phosphorus element-containing epoxy resin compositions27US 6,645,631 B2Dow Global Technologies LLC · 2003
- Curable film-forming composition exhibiting improved yellowing resistance27US 6,863,982 B2PPG Industries Ohio, Inc. · 2005