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US 2024/0093072 A1Published application
One-component toughened epoxy adhesives
AssigneeDdp Specialty Electronic Materials US, LLC
InventorsFelix Koch, Andreas Lutz, Cathy Grossnickel, Jeannine Flueckiger
Life of this patent
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Abstract
One-component epoxy adhesives containing a phosphorus-modified epoxy resin, a toughener and an epoxy resin that is neither rubber-modified nor phosphorus-modified. These adhesives are structural adhesives useful in automotive applications. They exhibit particularly good corrosion resistance.
Claims11
A one component toughened epoxy adhesive comprising
- A) an epoxy resin selected from a non-rubber-modified epoxy resin, non-phosphorous-modified epoxy resin or a mixture thereof, the epoxy resin being a liquid at 23° C.;
- B) a polymer having a number average molecular weight of up to 35,000, wherein the polymer contains one or more reactive groups being a urethane group or a urea group, or a mixture thereof, wherein the polymer has a) at least one polyether and/or diene rubber segment having a weight of at least 1000 atomic mass units and b) capped isocyanate groups;
- C) at least one epoxy curing catalyst;
- D) a curing agent;
- and
- E) 5 to 50 wt. %, based on the weight of the adhesive, of an epoxy containing adduct of an epoxy resin and a phosphorus acid;
- wherein said one component toughened epoxy adhesive further contains no more than 2 parts by weight of a plasticizer per part by weight of component B) and contains no more than 7 weight percent of core shell rubber particles;
- and
- wherein the adhesive exhibits a curing temperature of at least 60° C.
6 more elements
Dependencies are inferred from the claim text.