US 6,900,269 B2 · Halogen-free resin composition

Abstract

Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Claims20

Dependent claims

A halogen-free resin composition, comprising the following components:

(A) one or more phosphorus-containing epoxy resins;
(B) a hardener;
(C) a hardening accelerator;
(D) a polyphenylene oxide resin;
and
(E) a filling material, wherein the hardener of component (B) has the structure represented by the following formula (I):
wherein R1 is one selected from the group consisting of an alkyl group, an alkenyl group, an alkoxyl group, a hydroxy group and an amino group;
R2 is one selected from the group consisting of a bond, an alkylene group, O, S and SO2;
R3 is H or an alkyl group;
and and n are independently an integer of 0 to 4.

7 more elements

Dependencies are inferred from the claim text.

Halogen-free resin composition

Life of this patent

Halogen-free resin composition

Life of this patent

Abstract

Claims20