Resin composition, method for forming cured product, and cured product

A resin composition comprising:

• (A) copper particles having an average particle diameter in a range from 0.1 to 20 μm;
• (B) phosphoric acid-modified epoxy resin obtained by reacting phosphoric acid (b1) with an epoxy compound (b2);
• (C) a curing agent;
• and
• (D) xylene resin, resol type phenol resin, or a combination thereof, excluding the component (B),
• wherein a content of the component (B), a content of the component (C), and a content of the component (D), each relative to a total amount of the components (A), (B), and (C) as 100 parts by mass, are in a range from 0.1 to 30 parts by mass, in a range from 0.1 to 5 parts by mass, and in a range from 1 to 30 parts by mass, respectively, and wherein a volume resistance value of a cured product of the composition does not exceed 1.5×10−3(Ω·cm), where the volume resistance value of the cured product is measured by coating a glass substrate with the composition so as to have a thickness of 30 μm, heating the coating at temperature of 150° C. for 30 minutes, and measuring the volume resistance value of the heated coating by a four-point probe method.