C04B 2237/708
Of one or more of the interlayers
Official title: of one or more of the interlayers
C04B2237/708 (Of one or more of the interlayers) appears on 673 US grants and 488 published applications in this corpus.
Search patents in C04B- Granted patents
- 673
- Published applications
- 488
- Assignees
- 320
- Inventors
- 1,458
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 3 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 4 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 14 | 0 |
| 1988 | 17 | 0 |
| 1989 | 29 | 0 |
| 1990 | 17 | 0 |
| 1991 | 23 | 0 |
| 1992 | 21 | 0 |
| 1993 | 20 | 0 |
| 1994 | 21 | 0 |
| 1995 | 11 | 0 |
| 1996 | 12 | 0 |
| 1997 | 4 | 0 |
| 1998 | 13 | 0 |
| 1999 | 15 | 0 |
| 2000 | 19 | 0 |
| 2001 | 15 | 4 |
| 2002 | 13 | 14 |
| 2003 | 14 | 11 |
| 2004 | 9 | 25 |
| 2005 | 10 | 14 |
| 2006 | 7 | 14 |
| 2007 | 5 | 15 |
| 2008 | 7 | 15 |
| 2009 | 6 | 13 |
| 2010 | 12 | 23 |
| 2011 | 6 | 15 |
| 2012 | 13 | 31 |
| 2013 | 19 | 24 |
| 2014 | 15 | 36 |
| 2015 | 30 | 30 |
| 2016 | 21 | 23 |
| 2017 | 24 | 30 |
| 2018 | 24 | 22 |
| 2019 | 21 | 19 |
| 2020 | 17 | 19 |
| 2021 | 15 | 14 |
| 2022 | 11 | 21 |
| 2023 | 12 | 19 |
| 2024 | 20 | 12 |
| 2025 | 9 | 15 |
| 2026 | 11 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Composite body comprising silicon carbide and method for producing same11 Aug 2026US 12,703,176 B2National Institute of Advanced Industrial Science and Technology
- Graphite-based infrastructures for handling molten metals and methods of forming thereof21 Jul 2026US 12,686,645 B2Fourth Power, Inc.
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Device comprising a ceramic substrate and method for producing same19 May 2026US 12,635,519 B2Robert Bosch GmbH
- Laminate for circuit board21 Apr 2026US 12,610,461 B2Tokuyama Corporation
- Method for Obtaining at Least One Ceramic Component by Joining at Least Two Ceramic SIC Preforms and Ceramic Components Obtained by Said Method20 Aug 2026US 2026/0242299 A1CeramTec GmbH
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Composite substrate and device6 Aug 2026US 2026/0226657 A1NGK Insulators, Ltd.
Most cited
By later US patents
- Halogen gas plasma-resistive members and method for producing the same, laminates, and corrosion-resistant members455US 6,783,875 B2NGK Insulators, Ltd. · 2004
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Direct bonding of metals to ceramics and metals132US 3,994,430 AGeneral Electric Company · 1976
- Supported polycrystalline diamond compact having a cubic boron nitride interlayer for improved physical properties131US 5,510,193 AGeneral Electric Company · 1996
- Methods for hermetically sealing ceramic to metallic surfaces and assemblies incorporating such seals130US 6,221,513 B1Pacific Coast Technologies, Inc. · 2001