C04B 2237/706
Of one or more of the metallic layers or articles
Official title: of one or more of the metallic layers or articles
C04B2237/706 (Of one or more of the metallic layers or articles) appears on 316 US grants and 282 published applications in this corpus.
Search patents in C04B- Granted patents
- 316
- Published applications
- 282
- Assignees
- 159
- Inventors
- 684
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 0 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 11 | 0 |
| 2000 | 9 | 0 |
| 2001 | 8 | 2 |
| 2002 | 11 | 6 |
| 2003 | 6 | 17 |
| 2004 | 9 | 16 |
| 2005 | 12 | 8 |
| 2006 | 8 | 5 |
| 2007 | 5 | 6 |
| 2008 | 6 | 7 |
| 2009 | 4 | 2 |
| 2010 | 4 | 7 |
| 2011 | 3 | 4 |
| 2012 | 4 | 15 |
| 2013 | 3 | 6 |
| 2014 | 9 | 13 |
| 2015 | 8 | 16 |
| 2016 | 7 | 12 |
| 2017 | 16 | 12 |
| 2018 | 9 | 14 |
| 2019 | 13 | 10 |
| 2020 | 12 | 12 |
| 2021 | 11 | 18 |
| 2022 | 9 | 18 |
| 2023 | 11 | 16 |
| 2024 | 12 | 15 |
| 2025 | 11 | 16 |
| 2026 | 6 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Device comprising a ceramic substrate and method for producing same19 May 2026US 12,635,519 B2Robert Bosch GmbH
- Laminate for circuit board21 Apr 2026US 12,610,461 B2Tokuyama Corporation
- Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such a method17 Feb 2026US 12,552,722 B2Rogers Germany GmbH
- Processing apparatuses and methods of using27 Jan 2026US 12,533,869 B2QuantumScape Battery, Inc.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Improved aluminum-containing nitride ceramic matrix composite, method of making, and method of use20 Aug 2026US 2026/0242660 A1SLT Technologies, Inc.
- Processing apparatuses and methods of using13 Aug 2026US 2026/0233495 A1QuantumScape Battery, Inc.
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Silicon nitride sintered body, silicon nitride substrate, silicon nitride circuit board, and semiconductor device16 Jul 2026US 2026/0200804 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Supported polycrystalline diamond compact having a cubic boron nitride interlayer for improved physical properties131US 5,510,193 AGeneral Electric Company · 1996
- Living hard tissue replacement, its preparation127US 5,125,971 ATDK Corporation · 1992
- Bonds between metal and a non-metallic substrate69US 3,993,411 AGeneral Electric Company · 1976
- Polycrystalline diamond and cemented carbide substrate and synthesizing process therefor65US 4,380,471 AGeneral Electric Company · 1983
- Ceramic substrate having a sealed layer59US 6,136,419 AInternational Business Machines Corporation · 2000