C04B 2237/592
Whereby the interlayer is not continuous
Official title: whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
C04B2237/592 (Whereby the interlayer is not continuous) appears on 167 US grants and 132 published applications in this corpus.
Search patents in C04B- Granted patents
- 167
- Published applications
- 132
- Assignees
- 121
- Inventors
- 394
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 5 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 1 | 2 |
| 2002 | 4 | 1 |
| 2003 | 5 | 1 |
| 2004 | 1 | 5 |
| 2005 | 2 | 1 |
| 2006 | 1 | 3 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 2 | 3 |
| 2010 | 0 | 3 |
| 2011 | 1 | 5 |
| 2012 | 6 | 10 |
| 2013 | 4 | 7 |
| 2014 | 5 | 5 |
| 2015 | 8 | 12 |
| 2016 | 3 | 14 |
| 2017 | 9 | 9 |
| 2018 | 7 | 4 |
| 2019 | 10 | 8 |
| 2020 | 8 | 10 |
| 2021 | 6 | 5 |
| 2022 | 2 | 7 |
| 2023 | 6 | 10 |
| 2024 | 6 | 2 |
| 2025 | 7 | 1 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multi-layer ceramic plate device24 Feb 2026US 12,558,734 B2Watlow Electric Manufacturing Company
- Semiconductor device13 Jan 2026US 12,525,504 B2Fuji Electric Co., Ltd.
- Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such method9 Dec 2025US 12,495,491 B2Rogers Germany GmbH
- Copper-ceramic bonded body, insulated circuit board, method for producing copper-ceramic bonded body, and method for producing insulated circuit board21 Oct 2025US 12,451,404 B2Mitsubishi Materials Corporation
- Ultrafast laser welding of ceramics12 Aug 2025US 12,384,728 B2The Regents of the University of California
- Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same13 Feb 2025US 2025/0050439 A1Watlow Electric Manufacturing Company
- Method for integrally bonding a glass element to a support element, and optical device17 Oct 2024US 2024/0343654 A1JENOPTIK Optical Systems GmbH
- Unitary ceramic components and methods of forming the same22 Aug 2024US 2024/0279125 A1General Electric Company
- Multi-layer ceramic plate device2 Nov 2023US 2023/0347436 A1Watlow Electric Manufacturing Company
- Joined body, holding device, and electrostatic chuck5 Oct 2023US 2023/0311451 A1Ngk Spark Plug Co., Ltd.
Most cited
By later US patents
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Method of attaching ceramics to metals for high temperature operation and laminated composite91US 4,338,380 ABrunswick Corporation · 1982
- Chemical bonding of metals to ceramic materials58US 4,050,956 ACommonwealth Scientific and Industrial Research Organization · 1977
- Device for high thermal stress connection between a part made of a ceramic material and a part made of a metallic material52US 4,281,941 AVolkswagenwerk Aktiengesellschaft · 1981
- Porous ceramic seals and method of making same47US 4,075,364 ABrunswick Corporation · 1978