C04B 2237/59
Aspects relating to the structure of the interlayer
C04B2237/59 (Aspects relating to the structure of the interlayer) appears on 265 US grants and 235 published applications in this corpus.
Search patents in C04B- Granted patents
- 265
- Published applications
- 235
- Assignees
- 167
- Inventors
- 648
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 3 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 9 | 0 |
| 2001 | 1 | 2 |
| 2002 | 7 | 5 |
| 2003 | 7 | 5 |
| 2004 | 6 | 7 |
| 2005 | 3 | 4 |
| 2006 | 4 | 4 |
| 2007 | 0 | 3 |
| 2008 | 0 | 5 |
| 2009 | 4 | 5 |
| 2010 | 0 | 6 |
| 2011 | 2 | 6 |
| 2012 | 10 | 14 |
| 2013 | 5 | 15 |
| 2014 | 8 | 10 |
| 2015 | 11 | 22 |
| 2016 | 8 | 22 |
| 2017 | 18 | 18 |
| 2018 | 12 | 7 |
| 2019 | 14 | 11 |
| 2020 | 11 | 16 |
| 2021 | 7 | 10 |
| 2022 | 5 | 10 |
| 2023 | 11 | 17 |
| 2024 | 13 | 5 |
| 2025 | 10 | 5 |
| 2026 | 6 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonded substrate14 Jul 2026US 12,679,778 B2NGK Insulators, Ltd.
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,268 B2Mitsubishi Materials Corporation
- Cutting tool7 Apr 2026US 12,594,599 B2AB Sandvik Coromant
- Multilayered capacitor and manufacturing method thereof24 Mar 2026US 12,586,728 B2Samsung Electro-Mechanics Co., Ltd.
- Multi-layer ceramic plate device24 Feb 2026US 12,558,734 B2Watlow Electric Manufacturing Company
- Method of manufacturing multilayer electronic component5 Mar 2026US 2026/0066194 A1Samsung Electro-Mechanics Co., Ltd.
- Multilayer electronic component and method of manufacturing the same18 Dec 2025US 2025/0385049 A1Samsung Electro-Mechanics Co., Ltd.
- Power semiconductor module arrangement and method for producing the same14 Aug 2025US 2025/0259923 A1
- Multilayer electronic component22 May 2025US 2025/0166910 A1Samsung Electro-Mechanics Co., Ltd.
- Composite substrate, and substrate for epitaxially growing group 13 element nitride8 May 2025US 2025/0146179 A1NGK Insulators, Ltd.
Most cited
By later US patents
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Composite material bonded by an amorphous metal, and preparation thereof152US 4,621,031 ADresser Industries, Inc. · 1986
- Method of attaching ceramics to metals for high temperature operation and laminated composite91US 4,338,380 ABrunswick Corporation · 1982
- Ceramic bonding method72US 5,392,982 A1995
- Ceramic composite68US 5,874,175 A1999