B41J 2/1635

Dividing the wafer into individual chips

Official title: {dividing the wafer into individual chips}

B41J2/1635 (Dividing the wafer into individual chips) appears on 1,511 US grants and 1,407 published applications in this corpus.

Search patents in B41J
Granted patents
1,511
Published applications
1,407
Assignees
97
Inventors
787
Latest grant
22 Sep 2026

Filings by year

B41J 2/1635: granted patents and published applications per publication year
YearGranted patentsPublished applications
198610
198730
198820
198960
199030
199140
199270
199340
199430
199550
199670
1997200
1998190
1999250
2000160
20017928
20025549
20035457
200455159
200588208
2006150108
2007130126
2008110149
2009132145
201011985
201114647
20124330
20132741
20142216
20153311
2016219
2017813
20181230
20193113
20201114
20211310
20221018
20231516
2024713
202575
202687

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Recent patents

Most cited

By later US patents