Micro-electromechanical die module with planarized thick film layer

A method of fabricating a plurality of micro-electromechanical die modules having a patterned, polymeric thick film layer bonded between two substrates, comprising the steps of:

• (a) forming a plurality of electrical circuits on a planar surface of a first substrate;
• (b) passivating the electrical circuits;
• (c) depositing a thick film, polymeric insulative layer on the first substrate surface and over the passivated electrical circuits, said thick film layer having an outer surface;
• (d) patterning the thick film layer to provide at least one recess in the thick film layer at locations for each electrical circuit, each recess having an edge at the outer surface of the thick film layer;
• (e) curing the patterned thick film layer on the first substrate;
• (f) performing a chemical-mechanical polishing of the outer surface of the patterned thick film layer to planarize the outer surface of the patterned thick film layer and remove topographic formations produced by any of the previous steps;
• and
• (g) bonding a planar surface of a second substrate to the planarized outer surface of the patterned thick film layer on the first substrate.