Method of manufacturing liquid discharging head and liquid discharging head

A method of manufacturing a liquid discharging head having an element board and an electric wiring board that is electrically connected to the element board, wherein the element board includes a discharge port formation member having a discharge port for discharging liquid and the element board further includes an element configured to supply energy to the discharge port for discharging the liquid, the method comprising:

• preparing a wafer that is provided with the element and the discharge port formation member on a front surface of the wafer;
• forming a recessed portion in a rear surface of the wafer;
• attaching the rear surface of the wafer and a dicing tape;
• cutting the wafer along a plurality of cutting lines formed on the front surface of the wafer and forming the element board;
• and
• connecting the electric wiring board and a terminal of the element board,
• wherein, when seen from a direction perpendicular to the front surface of the wafer, the recessed portion is formed at a location corresponding to the plurality of cutting lines, and an area of a region where the terminal overlaps the recessed portion is smaller than an area of a region where the terminal does not overlap the recessed portion, and
• wherein the recessed portion is formed by wet etching of the wafer.

A method of manufacturing a liquid discharging head having an element board and an electric wiring board that is electrically connected to the element board, wherein the element board includes a discharge port formation member having a discharge port for discharging liquid and the element board further includes an element configured to supply energy to the discharge port for discharging the liquid, the method comprising:

• preparing a wafer that is provided with the element and the discharge port formation member on a front surface of the wafer;
• forming a recessed portion in a rear surface of the wafer;
• attaching the rear surface of the wafer and a dicing tape;
• cutting the wafer along a plurality of cutting lines formed on the front surface of the wafer and forming the element board;
• and
• connecting the electric wiring board and a terminal of the element board, wherein, when seen from a direction perpendicular to the front surface of the wafer, the recessed portion is formed at a location corresponding to the plurality of cutting lines, and an area of a region where the terminal overlaps the recessed portion is smaller than an area of a region where the terminal does not overlap the recessed portion, and
• wherein the plurality of cutting lines is groove-shaped cut-out parts provided in a resin material of which the discharge port formation member is made.