Method for manufacturing substrate bonded body and method for manufacturing liquid ejection substrate
AssigneeCanon Kabushiki Kaisha
InventorTetsushi Ishikawa
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Abstract
Provided is a method for manufacturing a substrate bonded body in which a first substrate and a second substrate are bonded together, the first substrate forming a first portion of an element, and the second substrate forming a second portion of the element, including: a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substrate, such that the bonding face has a convex shape toward the second substrate; a contact step of bringing the first substrate and the second substrate closer and into contact with each other; and a bonding step of bonding the first substrate and the second substrate by an adhesive.
Claims19
A method for manufacturing a substrate bonded body in which a first substrate and a second substrate are bonded together, the first substrate forming a first portion of an element, and the second substrate forming a second portion of the element, comprising:
- a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substrate, such that the bonding face has a convex shape toward the second substrate;
- a contact step of bringing the first substrate and the second substrate closer and into contact with each other;
- and
- a bonding step of bonding the first substrate and the second substrate by an adhesive,
- wherein, in the film-forming step, the inorganic film is formed so as to have a convexity amount of 0.1 to 3 mm, the convexity amount being a distance between an apex of the convex shape of the bonding face of the first substrate and the bonding face of the first substrate in a flat state.
A method for manufacturing a substrate bonded body in which a first substrate and a second substrate are bonded together, the first substrate forming a first portion of an element, and the second substrate forming a second portion of the element, comprising:
- a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substrate, such that the bonding face has a convex shape toward the second substrate;
- a contact step of bringing the first substrate and the second substrate closer and into contact with each other;
- and
- a bonding step of bonding the first substrate and the second substrate by an adhesive,
- wherein, in the film-forming step, the inorganic film is formed such that the convex bonding face of the first substrate has a saddle-shaped face that is convex along a direction that is perpendicular to a specific straight line extending through a center of the bonding face, from a circumferential edge of the bonding face to the straight line.
A method for manufacturing a liquid ejection substrate in which a first substrate and a second substrate are bonded together, the first substrate having an ejection port that ejects liquid and a first channel that is in communication with the ejection port and supplies the liquid, and the second substrate having a second channel that is connected to the first channel to form a channel, comprising:
- a film-forming step of forming an inorganic film on a bonding face of the first substrate, the bonding face facing the second substrate, such that the bonding face has a convex shape toward the second substrate;
- a contact step of bringing the first substrate and the second substrate closer and into contact with each other;
- and
- a bonding step of bonding the first substrate and the second substrate by an adhesive,
- wherein, in the film-forming step, the inorganic film is formed so as to have a convexity amount of 0.1 to 3 mm, the convexity amount being a distance between an apex of the convex shape of the bonding face of the first substrate and the bonding face of the first substrate in a flat state.
Dependencies are inferred from the claim text.