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US 5,841,452 AGranted
Method of fabricating bubblejet print devices using semiconductor fabrication techniques
AssigneesCanon Information Systems Research Australia Pty. Ltd., Canon Kabushiki Kaisha
InventorKia Silverbrook
Life of this patent
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Abstract
A method of fabricating bubblejet print devices uses semiconductor fabrication techniques, and this method involves forming a heater means and an electrical connection to the heater means on a substrate, and forming a passageway through the substrate. A given end of the passageway is disposed adjacent to the heater means, and this given end is formed as an outlet for ejecting ink.
Claims10
A method of fabricating a bubblejet print device using semiconductor fabrication techniques, said method comprising the steps of:
- forming a heater means and an electrical connection to said heater means on a substrate;
- forming a first hole adjacent to said heater means from one said of said substrate where said heater means is arranged, said first hole being served as an ejecting port for ejecting an ink;
- and
- forming a second hole on said substrate from the other side of said substrate which is opposite to the one side of said substrate where said heater means is arranged to communicate between said first and said second holes, thereby forming a through hole including said first and said second holes.
1 more element
Dependencies are inferred from the claim text.