B29L 2031/3406
Components
Official title: {Components, e.g. resistors}
B29L2031/3406 (Components) appears on 276 US grants and 300 published applications in this corpus.
Search patents in B29L- Granted patents
- 276
- Published applications
- 300
- Assignees
- 245
- Inventors
- 799
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 4 | 0 |
| 1987 | 4 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 2 | 3 |
| 2003 | 3 | 6 |
| 2004 | 4 | 6 |
| 2005 | 1 | 5 |
| 2006 | 3 | 3 |
| 2007 | 1 | 4 |
| 2008 | 1 | 4 |
| 2009 | 2 | 4 |
| 2010 | 2 | 4 |
| 2011 | 4 | 4 |
| 2012 | 5 | 2 |
| 2013 | 4 | 3 |
| 2014 | 1 | 8 |
| 2015 | 6 | 23 |
| 2016 | 10 | 25 |
| 2017 | 16 | 18 |
| 2018 | 19 | 22 |
| 2019 | 15 | 19 |
| 2020 | 19 | 20 |
| 2021 | 15 | 15 |
| 2022 | 12 | 26 |
| 2023 | 16 | 14 |
| 2024 | 16 | 27 |
| 2025 | 11 | 12 |
| 2026 | 17 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Compression molding device and compression molding method29 Sep 2026US 12,746,711 B2Yamaha Robotics Co., Ltd.
- Method for producing resin molded product, film fixing member, liquid resin spreading mechanism and resin molding apparatus22 Sep 2026US 12,741,402 B2Towa Corporation
- Sensor system for dry powder electrode formation and methods of using the same8 Sep 2026US 12,728,565 B2Matthews International Corporation
- Two-part molding of device packages with spacers8 Sep 2026US 12,733,537 B2NXP USA, Inc.
- Mold release film11 Aug 2026US 12,703,126 B2Sumitomo Bakelite Co., Ltd.
- Nanoimprint lithography mold and nanoimprint lithography using same8 Oct 2026US 2026/0310109 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Single-phase coolant sprayer8 Oct 2026US 2026/0313836 A1
- Metal laminate-polymer resin composite and method of manufacturing the same6 Aug 2026US 2026/0225294 A1Dyp Co., Ltd.
- Overmolded plastic articles, uses thereof, method of making23 Jul 2026US 2026/0208408 A1Solvay Specialty Polymers USA, LLC
- System and method for manufacturing a semiconductor package structure16 Jul 2026US 2026/0206635 A1Advanced Semiconductor Engineering, Inc.
Most cited
By later US patents
- Method of fabricating composite or encapsulated articles97US 4,681,718 AHughes Aircraft Company · 1987
- Fiber/resin composites, and method of making the same75US 4,892,764 ALoctite Corporation · 1990
- Method for manufacturing an elastic composite body with metal wires embedded therein69US 4,520,562 AShin-Etsu Polymer Co., Ltd. · 1985
- Production method for anisotropic resin-bonded magnets66US 5,886,070 AAichi Steel Works, Ltd. · 1999
- Silicone resin electronic device encapsulant56US 5,051,275 AAT&T Bell Laboratories · 1991