Compression molding device and compression molding method

A compression molding method comprising:

• a resin sealing process of sealing a substrate on which an electronic component is mounted by using a block-shaped resin, within a sealing die comprising an upper die and a lower die, to process the substrate into a molded article;
• a resin supply step of supplying, as the block-shaped resin, a plurality of resins each having a cylindrically columnar shape or a prismatic columnar shape and having a lower surface in which an accommodation recess or an accommodation hole having an inner diameter and a depth able to accommodate the electronic component is bored;
• and
• a resin welding process that is performed when the substrate is disposed outside of the sealing die, of partially melting and placing each of the plurality of resins at a predetermined position of the substrate respectively and then welding the plurality of resins on the substrate by the partially melted resins.