Silicone resin electronic device encapsulant
AssigneeAT&T Bell Laboratories
InventorChing P. Wong
Life of this patent
Estimating the term…
Abstract
An electronic device is encapsulated by a curable material which, prior to cure, consists essentially of (a) 33 to 39 percent of a silicone resin selected from the group consisting of (i) polydimethylsiloxane, containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, (ii) polymethylphenylsiloxane containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, and (iii) a mixture of (i) and (ii), (b) 51 to 57 weight percent of silicon dioxide and (c) 8 to 12 weight percent of a low vapor pressure organic solvent, preferably an alcohol ester.
Claims7
A method for encapsulating at least part of an electronic device comprising the steps of making a mixture comprising 33 to 39 weight percent of a silicone resin, 51 to 57 weight percent of silicon dioxide and 8 to 12 weight percent of a high boiling point organic solvent;
- the silicone resin being selected from the group consisting of (i) polydimethylsiloxane containing a platinum catalyst and having functional components selected from the group consisting of vinyl and hydride functional components, (ii) polymethylphenylsiloxane containing a platinum catalyst and functional components selected from the group consisting of vinyl and hydride functional components and (iii) a mixture of polydimethylsiloxane and polymethylphenylsiloxane, each of which contains a platinum catalyst and functional components selected from the group consisting of vinyl and hydride functional components;
- depositing the mixture over an electronic device;
- and curing the mixture by heating it at an elevated temperature for a sufficient time to harden the mixture.
The method of claim 7 wherein:
- the electronic device is an integrated circuit.
Dependencies are inferred from the claim text.