Nanoimprint lithography mold and nanoimprint lithography using same

Abstract

A nanoimprint lithography (NIL) mold includes a mold body, an imprint pattern formed on a front side thereof, and thermal expansion material disposed in and/or on the mold body. A NIL method includes imprinting a pattern of a mold onto a layer disposed on a semiconductor wafer by pressing the pattern onto the layer, and performing overlay correction during the NIL by heating a thermal expansion material disposed in and/or on the mold by applying light thereto. A method includes: forming a pre-layer on a substrate; forming a resist layer over the pre-layer; imprinting a mold into the resist layer; generating an adjusted mold by adjusting a position of a pattern of the mold by heating thermal expansion portions on the mold; patterning the resist layer using the adjusted mold; removing the mold from the resist layer; and transferring a pattern of the resist layer to the pre-layer.

Dependencies are inferred from the claim text.