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US 2026/0206635 A1Published application
System and method for manufacturing a semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChenghan SHE
Life of this patent
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Abstract
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
Claims23
A method for manufacturing a package structure, comprising:
- providing a carrier;
- dispensing a first molding powder on a first region of the carrier;
- and
- dispensing a second molding powder on a second region of the carrier spaced apart from the first region of the carrier, wherein the second region and the first region are in substantially concentric shapes.
1 more element
(canceled)
A method for manufacturing a package structure, comprising:
- providing a carrier;
- dispensing a first molding powder on a first region of the carrier;
- weighing the first molding powder, and controlling an amount of a second molding powder according to a result of weighing the first molding powder;
- and
- dispensing the second molding powder on a second region of the carrier spaced apart from the first region of the carrier.
2 more elements
A method for manufacturing a package structure, comprising:
- providing a carrier;
- weighing a first molding powder when dispensing the first molding powder on the carrier,
- controlling an amount of a second molding powder according to a result of weighing the first molding powder;
- and
- dispensing the second molding powder on the carrier.
2 more elements
(canceled)
(canceled)
Dependencies are inferred from the claim text.