B29C 45/14655
Connected to or mounted on a carrier
Official title: {connected to or mounted on a carrier, e.g. lead frame}
B29C45/14655 (Connected to or mounted on a carrier) appears on 661 US grants and 569 published applications in this corpus.
Search patents in B29C- Granted patents
- 661
- Published applications
- 569
- Assignees
- 287
- Inventors
- 1,278
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 2 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 5 | 0 |
| 1994 | 14 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 17 | 0 |
| 1998 | 25 | 0 |
| 1999 | 33 | 0 |
| 2000 | 15 | 0 |
| 2001 | 19 | 8 |
| 2002 | 23 | 26 |
| 2003 | 22 | 32 |
| 2004 | 27 | 17 |
| 2005 | 14 | 15 |
| 2006 | 11 | 25 |
| 2007 | 15 | 28 |
| 2008 | 13 | 28 |
| 2009 | 15 | 33 |
| 2010 | 24 | 29 |
| 2011 | 29 | 27 |
| 2012 | 19 | 25 |
| 2013 | 22 | 24 |
| 2014 | 21 | 19 |
| 2015 | 16 | 14 |
| 2016 | 16 | 25 |
| 2017 | 16 | 22 |
| 2018 | 25 | 35 |
| 2019 | 20 | 21 |
| 2020 | 24 | 20 |
| 2021 | 22 | 18 |
| 2022 | 15 | 24 |
| 2023 | 15 | 17 |
| 2024 | 17 | 17 |
| 2025 | 20 | 11 |
| 2026 | 4 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Semiconductor module5 May 2026US 12,622,334 B2Rohm Co., Ltd.
- Semiconductor package injection molding mold, injection molding device and semiconductor package injection molding method21 Apr 2026US 12,605,868 B2JCET Management Co., Ltd.
- Molded electronic device and method for manufacturing same3 Feb 2026US 12,542,388 B2Faurecia Interieur Industrie
- Resin molding device and method for producing resin molded article13 Jan 2026US 12,521,926 B2Towa Corporation
- Lead connector with assembly frame and method of manufacture25 Nov 2025US 12,478,789 B2Heraeus Medical Components LLC
- Cable with molded body and method for manufacturing cable with molded body17 Sep 2026US 2026/0273820 A1Proterial, Ltd.
- Vacuum degasser, injection unit provided with same, and method for vacuum degassing27 Aug 2026US 2026/0249531 A1The Japan Steel Works, Ltd.
- Wiring unit, magnetic sensor unit, and method of manufacturing wiring unit6 Aug 2026US 2026/0227463 A1TDK Corporation
- Resin molding apparatus and method for producing resin molded product16 Jul 2026US 2026/0200149 A1Towa Corporation
- Display Device, Injection Mold11 Jun 2026US 2026/0164571 A1Boe Technology Group Co., Ltd.
Most cited
By later US patents
- Non-protruding optoelectronic lens1,266US 6,525,386 B1Masimo Corporation · 2003
- Mold tool for an optoelectronic element1,037US 6,830,711 B2Masimo Corporation · 2004
- Optoelectronic element with a non-protruding lens988US 7,067,893 B2Masimo Corporation · 2006
- Method of providing an optoelectronic element with a non-protruding lens861US 7,332,784 B2Masimo Corporation · 2008
- Encapsulation mold with removable cavity plates212US 4,332,537 A1982